期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2025

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2019, vol.19, no.1 2019, vol.19, no.10 2019, vol.19, no.11 2019, vol.19, no.12 2019, vol.19, no.2 2019, vol.19, no.3
2019, vol.19, no.4 2019, vol.19, no.5 2019, vol.19, no.6 2019, vol.19, no.8 2019, vol.19, no.9

题名作者出版年年卷期
Trends in Encapsulation of Electronic Components: Power electronics, increased requirements through miniaturizationKARL BITZER20192019, vol.19, no.4
Reflow Profiling for Next-Generation Solder AlloysMEAGAN SLOAN; KIM FLANAGAN; BROOK SANDY-SMITH; MB ALLEN20192019, vol.19, no.4
Time for the European EMS Market to be Consolidated: Katek SE Group has taken the first steps in that directionRAINER KOPPITZ20192019, vol.19, no.4
SiC Adoption is Accelerating: Is the Industrial Supply Chain Ready?CAMILLE VEYRIER20192019, vol.19, no.4
smtconnect: May 7-9, 2019, Messecentrum, Nuremberg, GermanyTrevor Galbraith20192019, vol.19, no.4
Some Bright Spots in a Difficult MarketTrevor Galbraith20192019, vol.19, no.4
ABchimie Interview - Jean-Pierre Douchy: Trevor Galbraith speaks with Jean-Pierre Douchy, Director of Sales at ABchimieTrevor Galbraith20192019, vol.19, no.4



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