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期刊
ISSN
0956-5515
刊名
Journal of Intelligent Manufacturing
参考译名
智能化制造业杂志
收藏年代
1999~2024
全部
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2021, vol.32, no.1
2021, vol.32, no.2
2021, vol.32, no.3
2021, vol.32, no.4
2021, vol.32, no.5
2021, vol.32, no.6
2021, vol.32, no.7
2021, vol.32, no.8
题名
作者
出版年
年卷期
Machine-learning for automatic prediction of flatness deviation considering the wear of the face mill teeth
Pimenov, Danil Yu; Mia, Mozammel; Kaplonek, Wojciech; Bustillo, Andres
2021
2021, vol.32, no.3
Critical joint identification for efficient sequencing
Sadeghi Tabar, Roham; Warmefjord, Kristina; Soderberg, Rikard; Lindkvist, Lars
2021
2021, vol.32, no.3
An experimental study of modified physical performance test of low-temperature epoxy grouting material for grouting joints with tenon and mortise
Su, Huifeng; Li, Renzhuang; Yang, Ming
2021
2021, vol.32, no.3
A self-organized approach for scheduling semiconductor manufacturing systems
Yu, Qingyun; Yang, Haolin; Lin, Kuo-Yi; Li, Li
2021
2021, vol.32, no.3
A post-quantum secure communication system for cloud manufacturing safety
Yi, Haibo
2021
2021, vol.32, no.3
Intelligent bearing structure and temperature field analysis based on finite element simulation for sustainable and green manufacturing
Zhang, Wenyuan; Wang, Heng; Chen, Jinhai
2021
2021, vol.32, no.3
An effective approach for the dual-resource flexible job shop scheduling problem considering loading and unloading
Wu, Xiuli; Peng, Junjian; Xiao, Xiao; Wu, Shaomin
2021
2021, vol.32, no.3
Implementation of a novel algorithm of wheelset and axle box concurrent fault identification based on an efficient neural network with the attention mechanism
Yao, Dechen; Liu, Hengchang; Yang, Jianwei; Zhang, Jiao
2021
2021, vol.32, no.3
Role of trochoidal machining process parameter and chip morphology studies during end milling of AISI D3 steel
Iqbal, U. Mohammed; Santhakumar, J.
2021
2021, vol.32, no.3
Multiple time-series convolutional neural network for fault detection and diagnosis and empirical study in semiconductor manufacturing
Hsu, Chia-Yu; Liu, Wei-Chen
2021
2021, vol.32, no.3
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