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期刊
ISSN
1063-7397
刊名
Russian Microelectronics
参考译名
俄罗斯微电子学
收藏年代
2002~2023
全部
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2022
2023
2022, vol.51, no.1
2022, vol.51, no.2
2022, vol.51, no.3
2022, vol.51, no.4
2022, vol.51, no.5
2022, vol.51, no.6
2022, vol.51, no.7
2022, vol.51, no.8
题名
作者
出版年
年卷期
Technology and Thermomechanics in Growing Tubular Silicon Single Crystals
Verezub N. A.; Kozhitov L. V.; Kondratenko T. T.; Prostomolotov A. I.; Silaev I. V.
2022
2022, vol.51, no.8
Protein Folding Quantum Circuit for Bio Material Modelling Compression
Lisnichenko M. O.; Protasov S. I.
2022
2022, vol.51, no.8
Evaluation of the Effect of FinFET Structure Parameters on Electrical Characteristics Using TCAD Modeling Tools
Petrosyants K. O.; Silkin D. S.; Popov D. A.
2022
2022, vol.51, no.8
Accounting for the Porosity of the Material in the Simulation of the Time-Dependent Dielectric Breakdown in the Metallization System of Integrated Circuits
Ganykina E. A.; Rezvanov A. A.; Orlov A. A.
2022
2022, vol.51, no.8
Failure-Tolerant Synchronous and Self-Timed Circuits Comparison
Zatsarinny A. A.; Stepchenkov Yu. A.; Diachenko Yu. G.; Rogdestvenski Yu. V.
2022
2022, vol.51, no.8
The Mechanism of a Film-Forming Medium during the RF Deposition of Ferroelectric Ceramics of the BaxSr1–xTiO3 Composition
Afanasiev M. S.
2022
2022, vol.51, no.8
Practice of the Visual Determination of the Direction of the Rotation of the Light Polarization Plane in Gyrotropic Uniaxial Single Crystals
Zabelina E. V.; Kozlova N. S.; Svistkova I. I.
2022
2022, vol.51, no.8
Temperature Studies of Hall Field Sensors Based on Nanosized Silicon-on-Insulator Heterostructures
Abgaryan K. K.; Leonov A. V.; Reviznikov D. L.
2022
2022, vol.51, no.8
Accounting for Heat Release in Small Volumes of Matter on the Example of the Growth of ZnO Microrods: Search for a Modeling Technique
Matyushkin I. V.; Telminov O. A.; Mikhaylov A. N.
2022
2022, vol.51, no.8
Effect of Treatment in Nitrogen Plasma on the Electrical Parameters of AlGaN/GaN Heterostructures
Enisherlova K. L.; Seidman L. A.; Bogolyubova S. Yu.
2022
2022, vol.51, no.8
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