期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2025



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024 2025

2024, vol.26, no.1 2024, vol.26, no.2 2024, vol.26, no.3 2024, vol.26, no.4

题名作者出版年年卷期
GUEST EDITORIAL: THE ELECTRONICS RESURGENCE INITIATIVE 2.0 FOR U.S. SEMICONDUCTOR MANUFACTURINGMichael DiBattista20242024, vol.26, no.1
FOUR-DIMENSIONAL SCANNING TRANSMISSION ELECTRON MICROSCOPY: PART II, CRYSTAL ORIENTATION AND PHASE, SHORT AND MEDIUM RANGE ORDER, AND ELECTROMAGNETIC FIELDSAaron C. Johnston-Peck; Andrew A. Herzing20242024, vol.26, no.1
ADVANCED CHARACTERIZATION OF MATERIALS USING ATOM PROBE TOMOGRAPHYJacob M. Garcia; Ann N. Chiaramonti20242024, vol.26, no.1
PROCESSES FORTHINNING AND POLISHING HIGHLY WARPED DIE TO A NEARLY CONSISTENTTHICKNESS: PART IIIKirk A. Martin20242024, vol.26, no.1
ISTFA 2023 HIGHLIGHTSFrank Altmann20242024, vol.26, no.1
A SUMMARY OF THE ISTFA 2023 PANEL DISCUSSION: CHARGING FORWARD: NAVIGATING RELIABILITY AND FAILURES IN POWER ELECTRONICSChuan Zhang; Erwin Hendarto; Renee Parente20242024, vol.26, no.1
ISTFA 2023 USER GROUP HIGHLIGHTSDaminda Dahanayaka; Joy Liao; Anita Madan20242024, vol.26, no.1
ISTFA 2023 ARTIFICIAL INTELLIGENCE (AI) IN FAILURE ANALYSIS USER GROUPFlorian Felux; Thomas Rodgers; James Demarest20242024, vol.26, no.1
ISTFA 2023 FOCUSED ION BEAM (FIB) USER GROUPValerie Brogden; Steve Herschbein; Michael Wong; Edward Principe20242024, vol.26, no.1
ISTFA 2023 SYSTEM IN PACKAGE (SIP) USER GROUPYan Li; Bryan Tracy; Wentao Qin20242024, vol.26, no.1
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