会议文集


会议名60th Annual Microelectronics and Packaging Conference and Exhibition (NordPac 2024)
中译名《第六十届微电子与封装年会暨展览会》
机构International Microelectronics and Packaging Society (IMAPS)
会议日期11-13 June 2024
会议地点Tampere, Finland
出版年2024
馆藏号353087


题名作者出版年
3D ceramic packaging; a solution to high-density device integration at harsh environmentsKhashayar Khazen; Pascal Metayer2024
Direct copper interconnection: laser direct structuring and morphological characterization of copper plated viasAlessandro Mellina Gottardo; Claudio Zafferoni; Riccardo Villa2024
Accelerate and optimize your packaging using large-scale multiphysics simulations in your browserRahul Nagaraja; Abhishek Deshmukh; Bassou Khouya; Jonni Lohi; Mika Lyly; Janne Ruuskanen; Alexandre Halbach2024
Molding Process Simulation and Viscoelastic Model for Package Warpage AnticipationMarco Rovitto2024
Development of a Non-contact Jet Dispensing of Liquid MetalsJan Maslik; Gustaf Martensson; Alessandro Gumiero; Elio Cometti; Klas Hjort2024
LTCC Back-scattered Polarization Duplexing Chipless RFID for Nearfield InterrogationEnrico Tolin; Achim Bahr; Andreas Wien; Peter Uhlig2024
Anti-biofouling PCL-based Polyurethane Permselective Film Packaging for Dopamine-sensing Brain ImplantStefanus Wirdatmadja; Vijay Singh Parihar; Lauri Sydanheimo; Merja Voutilainen; Minna Kellomaki; Leena Ukkonen2024
Optically pumped magnetometer arrays for magnetoencephalography (OPMMEG)Markku Lahti2024
Advanced Nano Packaging for Silicon Nanowire SensorsThambiraj Selvarathinam; Bruce Kim; Jeong H. Lee; Jong W. Park2024
Introduction of Digital System-In-Package building block for space applicationsHugo Garcia; Helene Jochem; Norbert Venet; Mirko Rocci; Andres Matias Dabas; Luca Sollecchia; Poul Juul; Kim Ankeraa; Monique Mayr; Paolo Scalmati; Giovanni Cucinella2024
Biodegradable and water-soluble DEG1 substrate for Printed Circuit Board applicationsHajdu Istvan; Hamadeh Amir; Lajter Peter Tamas; Geczy Attila2024
Simultaneous Modeling of Swelling and Heat Transfer in PolymersStefan Wagner; Mario Gschwandl; Roland Nagl; Michael Fischlschweiger; Tim Zeiner2024
Monolithic Fabrication of On-Paper Self-Charging Power Systems Through Direct Ink WritingYingchun Su; Yujie Fu; Shiqian Chen; Zheng Li; Han Xue; Jiantong Li2024
A Simulation Based Comparative Study on Thermal and Mechanical Performance of Silicone Grease and Graphene-enhanced Thermal Pad for Single-chip and Multi-chip Packaging ApplicationsJiabin Chen; Yunzheng Xuan; Yiran Liu; Jin Chen; Yuanyuan Wang; Johan Moller; Johan Liu2024
PurPest - developing a sensor system prototype for detecting pests in plantsDaniel Nilsen Wright; Andrea Ficke2024
Integration of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit Using Laser-Assisted BondingAleksandr Vlasov; Santeri Lehtinen; Evgenii Lepukhov; Heikki Virtanen; Samu-Pekka Ojanen; Jukka Viheriala; Mircea Guina2024
Advancements in Microelectronic and Optoelectronic Packaging: Novel Approaches for Enhanced Performance and ReliabilityGiovanni Zafarana; Luca Mauri; Enea Rizzi; Alessio Corazza2024
Sodium silicate as an enabler for wafer bonding of glass substrates and lidsParnika Gupta; Joseph O' Brien; Jun Su Lee; How Yuan Hwang; Kamil Gradkowski; Padraic E. Morrissey; Peter O'Brien2024
Assembly of optical micro-ring resonator-based ultrasound sensor for photoacoustic imagingEvgenii Lepukhov; Aleksandr Vlasov; Santhosh Pandian; Rainer Hainberger; Paul Mullner; Moritz Eggeling; Tapio Niemi2024
Co-Integration of microelectronics and photonics in novel sensorFirehun Dullo; Daniel Wright; Christopher Dirdal; Marco Povoli; Anneriudh Sundararajan; Milan Milosevic2024



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