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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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1995, vol.117, no.1
1995, vol.117, no.2
1995, vol.117, no.3
1995, vol.117, no.4
题名
作者
出版年
年卷期
The mechanics of the edge delamination test
Boris Mirman
1995
1995, vol.117, no.4
Simulation of heat transfer in a reflow soldering oven with air and nitrogen injection
Y. S. Son; T. L. Bergman; M. T. Hyun
1995
1995, vol.117, no.4
Review of heat transfer technologies in electronic equipment
L. T. Yeh
1995
1995, vol.117, no.4
Optima; chip layout on a printed circuit board using design sensitivity analysis of subdomain configuration
Seo Jin Joo; Byung Man Kwak
1995
1995, vol.117, no.4
Natural convection in shallow, horizontal air layers encountered in electronic cooling
Elias Papanicolaou; Sridhar Gopalakrishna
1995
1995, vol.117, no.4
Integrated infrared failure analysis of printed circuit boards
J. J. Miles; C. R. Zelak; J. M. Kliman; J. E. Sunderland
1995
1995, vol.117, no.4
Effect of wall conduction on natural convection in an enclosure with a centered heat source
Yi-Hsiang Huang; Suresh K. Aggarwal
1995
1995, vol.117, no.4
Computations for a three-by-three array of protrusions cooled by liquid immersion: effect of substrate thermal conductivity
D. Mukutmoni; Y. K. Joshi; M. D. Kelleher
1995
1995, vol.117, no.4
Comparison of two-phase electronic cooling using free jets and sprays
Kurt A. Estes; Issam Mudawar
1995
1995, vol.117, no.4
Cleaning and reflow of Pb-Sn C4 solder bumps
Caroline S. Lee; Doug C. Crafts; T. W. Eagar
1995
1995, vol.117, no.4
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