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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2023
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题名
作者
出版年
年卷期
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
Doranga, Sushil; Xie, Dongji; Lee, Jeffrey; Zhang, Andy; Shi, Xue; Khaldarov, Valeriy
2023
2023, vol.145, no.3
A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests
Tsai, M. Y.; Kuo, T. C.
2023
2023, vol.145, no.3
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
Mauromicale, Giuseppe; Calabretta, Michele; Scarcella, Giuseppe; Scelba, Giacomo; Sitta, Alessandro
2023
2023, vol.145, no.3
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
Kaur, Inderjot; Mujahid, Shiraz; Paudel, YubRaj; Rhee, Hongjoo; Singh, Prashant
2023
2023, vol.145, no.3
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
Hamasha, Sa'd; Alahmer, Ali; Belhadi, Mohamed El Amine; Wei, Xin
2023
2023, vol.145, no.3
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
Chang, Kaifeng; Li, Yun-Ze; Wang, Weishu
2023
2023, vol.145, no.3
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
Paret, Paul; Finegan, Donal; Narumanchi, Sreekant
2023
2023, vol.145, no.3
Mandrel Bend Test of Screen-Printed Silver Conductors
Chen, Rui; Chow, Justin; Zhou, Yi; Sitaraman, Suresh K.
2023
2023, vol.145, no.3
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
Alzoubi, Khalid; Hensel, Alexander; Haeussler, Felix; Ottinger, Bettina; Sippel, Marcel; Franke, Joerg
2023
2023, vol.145, no.3
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
Xu, Linmeng; Zhao, Wanying; Li, Junhui
2023
2023, vol.145, no.3
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