期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024


题名作者出版年年卷期
Heat Dissipation Design Based on Topology Optimization and Auxiliary MaterialsChen, Jiawei; Yan, Zhongming; Qiao, Yang; Lin, Feihong; Wang, Yu; Zhou, Hongcheng20242024, vol.146, no.2
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper PlatformLin, Yujui; Wei, Tiwei; Moy, Wyatt Jason; Chen, Hao; Gupta, Man Prakash; Degner, Michael; Asheghi, Mehdi; Goodson, Kenneth E.; Mantooth, H. Alan20242024, vol.146, no.2
The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision TechnologyWang, Tongju; Liu, Yahao; Zhang, Wenqian; Lei, Yongping; Lin, Jian; Fu, Hanguang; Lin, Zipeng20242024, vol.146, no.2
Hybrid Substrates for Heterogeneous IntegrationLau, John H.; Chen, Gary Chang-Fu; Yang, Channing Cheng-Lin; Teng, Vincent; Peng, Andy Yan-Jia; Huang, Jones Yu-Cheng; Liu, Hsing-Ning; Chen, Y. H.; Tseng, Tzyy-Jang; Li, Ming20242024, vol.146, no.2
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level CoolingKhalid, R.; Youssef, E.; Amalfi, R. L.; Wemhoff, A. P.; Ortega, A.20242024, vol.146, no.2
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device ApplicationsKumar, Amit; Majumder, Ayan; Cardenas, Ruander; Macdonald, Mark; Bhattacharya, Anandaroop20242024, vol.146, no.2
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip WarpageCai, Chongyang; Wang, Huayan; Yang, Junbo; Yin, Pengcheng; Park, S. B.20242024, vol.146, no.2
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat SinkOsman, Ammar; Moreno, Gilberto; Myers, Steve; Major, Joshua; Feng, Xuhui; Narumanchi, Sreekant V. J.; Joshi, Yogendra20242024, vol.146, no.2
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue LifeHa, Jonghwan; Lai, Yangyang; Yang, Junbo; Yin, Pengcheng; Park, Seungbae20242024, vol.146, no.2
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G MethodLall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David20242024, vol.146, no.2
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