期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2025



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024
2025


题名作者出版年年卷期
A Review of Mechanism and Technology of Hybrid BondingXu, Yipeng; Zeng, Yanping; Zhao, Yi; Lee, Choonghyun; He, Minhui; Liu, ZongfangXu, Yipeng; Zeng, Yanping; Zhao, Yi; Lee, Choonghyun; He, Minhui; Liu, Zongfang20252025, vol.147, no.1
Effect of Dispensing Type on Void Formation Using Convolutional Neural NetworkAzahari, Muhammad Taufik; Ling, Calvin; Abas, Aizat; Ng, Fei ChongAzahari, Muhammad Taufik; Ling, Calvin; Abas, Aizat; Ng, Fei Chong20252025, vol.147, no.1
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal CyclingApalowo, Rilwan Kayode; Abas, Mohamad Aizat; Mukhtar, Muhamed Abdul Fatah Muhamed; Ramli, Mohamad RiduwanApalowo, Rilwan Kayode; Abas, Mohamad Aizat; Mukhtar, Muhamed Abdul Fatah Muhamed; Ramli, Mohamad Riduwan20252025, vol.147, no.1
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine LearningLing, Calvin; Azahari, Muhammad Taufik; Abas, Mohamad Aizat; Ng, Fei ChongLing, Calvin; Azahari, Muhammad Taufik; Abas, Mohamad Aizat; Ng, Fei Chong20252025, vol.147, no.1
Co-Packaged Optics-Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated CircuitsLau, John H.Lau, John H.20252025, vol.147, no.1
Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated TemperaturesShishido, Nobuyuki; Hayama, Yutaka; Akinaga, Yuki; Taketomi, Shinya; Koganemaru, Masaaki; Hagihara, Seiya; Miyazaki, NoriyukiShishido, Nobuyuki; Hayama, Yutaka; Akinaga, Yuki; Taketomi, Shinya; Koganemaru, Masaaki; Hagihara, Seiya; Miyazaki, Noriyuki20252025, vol.147, no.1
Transient Liquid Phase Bond Acceleration Using Copper NanowiresHarris, John; Huitink, DavidHarris, John; Huitink, David20252025, vol.147, no.1
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up FilmsChin, Ian; Loh, Wei Keat; Kee, Seow Chien; He, Yi; Abdullah, Mohd. Zulkifly; Tsuriya, MasahiroChin, Ian; Loh, Wei Keat; Kee, Seow Chien; He, Yi; Abdullah, Mohd. Zulkifly; Tsuriya, Masahiro20252025, vol.147, no.1
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical ParametersChu, Liu; Shi, Jiajia; de Cursi, Eduardo SouzaChu, Liu; Shi, Jiajia; de Cursi, Eduardo Souza20252025, vol.147, no.1
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder JointsVinson, Whit; Huitink, DavidVinson, Whit; Huitink, David20252025, vol.147, no.1
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