期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

1995, vol.117, no.1 1995, vol.117, no.2 1995, vol.117, no.3 1995, vol.117, no.4

题名作者出版年年卷期
A global sensitivity approach for the dynamic response of printed wiring boardsH. Jensen; A. O. Cifuentes19951995, vol.117, no.1
An approximate method for predicting laminar heat transfer between parallel plates having embedded heat sourcesR. S. Figliola; P. G. Thomas19951995, vol.117, no.1
Contact analysis of regular patterned rough surfaces in magnetic recordingBharat Bhushan; Xuefeng Tian19951995, vol.117, no.1
Fatigue of microlithographically-patterned free-standing aluminum thin film under axial stressesDavid T. Read; James W. Dally19951995, vol.117, no.1
Forced convective cooling enhancement through a double layer designB. T. F. Chung; H. H. Li19951995, vol.117, no.1
How compliant should a die-attachment be to protect the chip from substrate bowing?E. Suhir19951995, vol.117, no.1
Laminar heat transfer between a series of parallel plates with surface-mounted discrete heat sourcesS. H. Kim; N. K. Anand19951995, vol.117, no.1
Numerical study of forced convection in a partially porous channel with discrete heat sourcesH. A. Hadim; A. Bethancourt19951995, vol.117, no.1
On the natural convection in cavity with a cooled top wall and multiple protruding heatersC. P. Desai; K. Vafai; M. Keyhani19951995, vol.117, no.1
Steady-state investigation of vapor deposited micro heat pipe arraysA. K. Mallik; G. P. Peterson19951995, vol.117, no.1
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