期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1996, vol.118, no.1 1996, vol.118, no.2 1996, vol.118, no.3 1996, vol.118, no.4

题名作者出版年年卷期
A nonlinear multi-domain stress analysis method for surface-mount solder jointsS. Ling; A. Dasgupta19961996, vol.118, no.2
A thermal fatigue failure mechanism of 58Bi-42Sn solder jointsZequn Mei; Helen Holder19961996, vol.118, no.2
An empirical crack propagation model and its applications for solder jointsJimmy M. Hu19961996, vol.118, no.2
An experimental technique for studying mixed-mode fatigue crack growth in solder jointsDaping Yao; Z. Zhang; J. K. Shang19961996, vol.118, no.2
Bus bar solder joint durability evaluationT. Eric Wong; Harold M. Cohen19961996, vol.118, no.2
Determination of parameters affecting solder paste tack strength as measured in the IPC tack test: a classical design of experiments approachScott Anson; C. Sahay; Linda Head; James Constable19961996, vol.118, no.2
Effect of microstructure size on deformation kinetics and thermo-mechanical fatigue of 63Sn37Pb solder jointsZhenfeng Guo; Hans Conrad19961996, vol.118, no.2
Energy approach to the fatigue of 60/40 solder: part II -- influence of hold time and asymmetric loadingH. D. Solomon; E. D. Tolksdorf19961996, vol.118, no.2
Fatigue crack initiation in solder jointsZ. Zhang; Daping Yao; J. K. Shang19961996, vol.118, no.2
Shock and vibration of solder bumped flip chip on organic coated copper boardsJohn Lau; Eric Schneider; Tom Baker19961996, vol.118, no.2
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