期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1996, vol.118, no.1 1996, vol.118, no.2 1996, vol.118, no.3 1996, vol.118, no.4

题名作者出版年年卷期
A procedure for automated shape and life prediction in flip-chip and BGA solder jointsG. Subbarayan19961996, vol.118, no.3
Computer simulation of solder bridging phenomenaT. J. Singler; Xu Zhang; K. A. Brakke19961996, vol.118, no.3
Dynamic aspects of wetting balance testsK. W. Moon; W. J. Boettinger; M. E. Williams; D. Josell; B. T. Murray; W. C. Carter; C. A. Handwerke19961996, vol.118, no.3
Effect of interface roughness on fatigue crack growth in Sn-Pb solder jointsJ. K. Shang; Daping Yao19961996, vol.118, no.3
Impact of tapering on interfacial stressesBoris Mirman19961996, vol.118, no.3
Parametric finite element method for predicting shapes of three-dimensional solder jointsN. J. Nigro; F. J. Zhou; S. M. Heinrich; A. F. Elkouh; R. A. Fournelle; P. S. Lee19961996, vol.118, no.3
Prediction of fatigue failure of 60Sn-40Pb solder using constitutive model for cyclic viscoplasticityHiromasa Ishikawa; Katsuhiko Sasaki; Ken-ichi Ohguchi19961996, vol.118, no.3
Prediction of solder joint geometries in array-type interconnectsS. M.Heinrich; M. Schaefer; S. A. Schroeder; P. S. Lee19961996, vol.118, no.3
Reliability simulations for solder joints using stochastic finite element and artificial neural network modelsG. Subbarayan; Y. Li; R. L. Mahajan19961996, vol.118, no.3
Simulation and interpretation of wetting balance tests using the surface evolverD. C. Whalley; P. P. Conway19961996, vol.118, no.3
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