期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1996, vol.118, no.1 1996, vol.118, no.2 1996, vol.118, no.3 1996, vol.118, no.4

题名作者出版年年卷期
A model study of thermal stress-induced voiding in electronic packagesY. Huang; K. X. Hu; C. P. Yeh; N. -Y. Li; K. C. Hwang19961996, vol.118, no.4
An experimental investigation of the effects of cycli8ng frequency and temperature on the fatigue life of 60 tin/40 lead solderGregory D. Leece; Ibrahim Miskioglu; David A. Nelson19961996, vol.118, no.4
An interfacial delamination analysis for multichip module thin film interconnectsK. X Hu; C. P. Yeh; X. S. Wu; K. Wyatt19961996, vol.118, no.4
An ultra-high power two-phase jet-impingement avionic clamshell moduleMurray E. Johns; Issam Mudawar19961996, vol.118, no.4
Analysis and modeling of lead coplanarity distributionsE. K. Buratynski19961996, vol.118, no.4
Ball grid array thermomechanical response during reflow assemblyT. E. Voth; T. L. Bergman19961996, vol.118, no.4
Calculation of forced-air cooling of electronic modules with a two-fluid model of turbulenceO. J. Ilegbusi19961996, vol.118, no.4
Development of an integrated design system for thermal reliability prediction of SMT solder interconnectsY. -H. Pao; E. Jih; V. Siddapureddy19961996, vol.118, no.4
Efficient heat transfer approximation for the chip-on-substrate problemTimothy S. Fisher; F. A. Zell; Kamal K. Sikka; Kenneth E. Torrance19961996, vol.118, no.4
Experimental investigation of the formation of surface mount solder jointsP. P. Conway; M. R. Kalantary; D. J. Williams19961996, vol.118, no.4
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