期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1997, vol.119, no.1 1997, vol.119, no.3 1997, vol.119, no.4

题名作者出版年年卷期
A comparison of computational and experimental results for flow and heat transfer from an array of heated blocksA. M. Anderson19971997, vol.119, no.1
A numerical simulation of conjugate heat transfer in an electronic package formed by embedded discrete heat sources in contact with a porous heat sinkA. G. Fedorov; R. Viskanta19971997, vol.119, no.1
Application of phase change materials to thermal control of electronic modules; a computational studyD. Pal; Y. K. Joshi19971997, vol.119, no.1
Micro heat exchangers consisting of pin arraysXiaoqing Yin; H. H. Bau19971997, vol.119, no.1
Numerical prediction of flow and heat transfer in an impingement heat sinkS. Sathe; K. M. Kellar; K. C. Karki; C. Tai; C. Lamb; S. V. Patankar19971997, vol.119, no.1
Numerical simulation of impingement air cooling from LSI packages with large plate fins by the penalty finite element methodT. Tanaka; H. Matsushima; A. Ueki; T. Atarashi19971997, vol.119, no.1
Pool boiling heat transfer with an array of flush-mounted, square heaters on a vertical surfaceS. M. You; T. W. Simon; A. Bar-Cohen19971997, vol.119, no.1
System for real-time measurement of thermally induced PWB/PWA warpageM. R. Stiteler; I. C. Ume19971997, vol.119, no.1
Thermal analysis and optimization of substrates with directionally enhanced conductivitiesK. K. Sikka; T. S. Fisher; K. E. Torrance19971997, vol.119, no.1
Thermal performance of pin-fin fan-sink assembliesR. A. Wirtz; R. Sohal; H. Wang19971997, vol.119, no.1



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