期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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1997, vol.119, no.1 1997, vol.119, no.3 1997, vol.119, no.4

题名作者出版年年卷期
0.4μm diameter nickel-filament silicone-matrix resilient composites for electromagnetic interference shieldingXiaoping Shui; D. D. L. Chung19971997, vol.119, no.4
Conjugate heat transfer with buoyancy effects from micro-chip sized repeated heatersD. Yu; T. A. Ameel; R. O. Warrington; R. F. Barron19971997, vol.119, no.4
Development of a two matrix model for thermal analysis of multichip moduleM. A. Butterbaugh19971997, vol.119, no.4
Fatigue life predictions for thermally loaded solder joints using a volume-weighted averaging techniqueH. U. Akay; N. H. Paydar; A. Bilgic19971997, vol.119, no.4
Improved analytical estimate of global CTE mismatch displacement in areal-array solder jointsS. M. Heinrich; S. Shakya; P. S. Lee19971997, vol.119, no.4
Prediction of solder geometry for an axisymmetric through-hole jointA. F. Elkouh; N. Ramasubramanian; T. F. Hsu; N. J. Nigro; S. M. Heinrich; P. S. Lee; D. Shangguan19971997, vol.119, no.4
Residual stress analysis of bimaterial strips under multiple thermal loadingJ. W. Tierney; J. W. Eischen19971997, vol.119, no.4
The impact of interfacial adhesion on PTH and via stress stateG. Subbarayan; K. Ramakrishna; B. G. Sammakia19971997, vol.119, no.4
Thermomechanical response of materials and interfaces in electronic packaging: part I -- unified constitutive model and calibrationC. S. Desai; J. Chia; T. Kundu; J. L. Prince19971997, vol.119, no.4
Thermomechanical response of materials and interfaces in electronic packaging: part II -- unified constitutive model and validation, and designC. S. Desai; J. Chia; T. Kundu; J. L. Prince19971997, vol.119, no.4
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