期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1998, vol.120, no.2 1998, vol.120, no.3 1998, vol.120, no.4

题名作者出版年年卷期
A review of changes and trends affecting military electronics manufacturingA. J. Rafanelli19981998, vol.120, no.2
An effective approach for three-dimensional finite element analysis of ball grid array typed packagesH. C. Cheng; K. N. Chiang; M. H. Lee19981998, vol.120, no.2
CBGA solder fillet shape prediction and design optimizationY. Li; R. L. Mahajan19981998, vol.120, no.2
Constitutive modeling of polymer films from viscoelasticity to viscoplasticityZ. Qian; M. Lu; S. Liu19981998, vol.120, no.2
Development in optical methods for reliability analysis in electronic packaging applicationsY. Guo; S. Liu19981998, vol.120, no.2
Electronic packaging reflow shape prediction for the solder mask defined ball grid arrayK. N. Chiang; W. L. Chen19981998, vol.120, no.2
Fatigue life estimation of solder joints in SMT-PGA packagesM. Mukai; T. Kawakami; Y. Hiruta; K. Takahashi; K. Kishimoto; T. Shibuya19981998, vol.120, no.2
Greep behavior of a flip-chip package by both FEM modeling and real time moire interferometryJ. Wang; Z. Qian; D. Zou; S. Liu19981998, vol.120, no.2
Installation effects on air temperatures within outdoor electronic cabinetsE. B. Zimmerman; G. T. Colwell19981998, vol.120, no.2
Investigation of the lead-on-chip package's reliabilityP. H. Tsao; L. C. Chang; T. C. Chen; C. Haung; C. Z. Chen19981998, vol.120, no.2
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