期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1998, vol.120, no.2 1998, vol.120, no.3 1998, vol.120, no.4

题名作者出版年年卷期
A two-body formulation for solder joint shape predictionF. P. Renken; G. Subbarayan19981998, vol.120, no.3
Analysis of bending and shearing of tri-layer laminations for solder joint reliabilityE. K. Buratynski19981998, vol.120, no.3
Applications of digital speckle correlation to microscopic strain measurement and materials' property characterizationH. Lu19981998, vol.120, no.3
Avionics passive cooling with microencapsulated phase change materialsA. J. Fossett; M. T. Maguire; A. A. Kudirka; F. E. Mills; D. A. Brown19981998, vol.120, no.3
Evaluation of elasto-plastic interfacial fracture parameters in solder-copper bimaterial using moire interferometryH. Krishnamoorthy; H. V. Tippur19981998, vol.120, no.3
Forced convective liquid cooling of arrays of arrays of protruding heated elements mounted in a rectangular ductA. Gupta; Y. Jaluria19981998, vol.120, no.3
In situ evaluation of residual stresses in an organic die-attach adhesiveA. S. Voloshin; P. -H. Tsao; R. A. Pearson19981998, vol.120, no.3
Optimization of finned heat sinks for impingement cooling of electronic packagesY. Kondo; M. Behnia; W. Nakayama; H. Matsushima19981998, vol.120, no.3
Package-to-board attach reliability-methodology and case study on OMPAC packageB. Nagaraj; M. Mahalingam19981998, vol.120, no.3
Performance analysis of double stack cold plates covering all conditions of asymmetric heat loadingR. J. Pieper; A. D. Kraus19981998, vol.120, no.3
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