期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

1999, vol.11, no.1 1999, vol.11, no.2 1999, vol.11, no.3

题名作者出版年年卷期
CSP compatibility in the SMT assembly processL. Alex Chen; Irene Sterian; Brain Smith; Damien Kirkpatrick19991999, vol.11, no.2
Mechanical stress and deformation of SMT components during temperature cycling and PCB bendingRiner W. Kuhl19991999, vol.11, no.2
Novel techniques for electronic component removalA. D. Stennett; D. C. Whalley19991999, vol.11, no.2
Reduction of voiding in eutectic ball grid array solder jointsWilliam Casey19991999, vol.11, no.2
Surface insulation resistance (SIR) response to various processing parametersLing Zou; Christopher Hunt19991999, vol.11, no.2
TMA, DMA, DSC and TGA of lead free soldersJohn H. Lau; Chris Chang19991999, vol.11, no.2



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