期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2016, vol.28, no.1 2016, vol.28, no.2 2016, vol.28, no.3 2016, vol.28, no.4

题名作者出版年年卷期
Investigation of soldering for crystalline silicon solar cellsYang, Hong; Wang, He; Cao, Dingyue20162016, vol.28, no.4
Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder jointsYan, Xingchen; Xu, Kexin; Wang, Junjie; Wei, Xicheng; Wang, Wurong20162016, vol.28, no.4
IC solder joint inspection based on the Gaussian mixture modelCai, Nian; Ye, Qian; Liu, Gen; Wang, Han; Yang, Zhijing20162016, vol.28, no.4
Simulating surface tension of Sn-based lead free solder using an artificial neural networkWu, Min; Su, Xiangyu20162016, vol.28, no.4
Preparation of PEG-rosin derivative for water soluble rosin fluxPhaphon, Kanlaya; Wacharasindhu, Sumrit; Petsom, Amorn20162016, vol.28, no.4
Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon viaWu, Mei-Ling; Lan, Jia-Shen20162016, vol.28, no.4
High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation methodKong, Xiangxia; Sun, F.; Yang, Miaosen; Liu, Yang20162016, vol.28, no.3
Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycleChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Chan, Y. C.; Liu, Changqing; Wu, Fengshun20162016, vol.28, no.3
Direct bonding of silicon with solders type Sn-Ag-TiKostolny, Igor; Sahul, Martin; Kolenak, Roman20162016, vol.28, no.3
Intermetallic growth and shear strength of SAC305/EN-BoronKahar, Hardinnawirda; Idris, Siti Rabiatull Aisha; Ishak, Mahadzir; Abd Malek, Zetty Akhtar20162016, vol.28, no.3
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