期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1995 1996 1997 1998 1999 2000
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1999, vol.121, no.1 1999, vol.121, no.2 1999, vol.121, no.3 1999, vol.121, no.4

题名作者出版年年卷期
Three-dimensional effects of solder joints in micro-scale BGA assemblyJ. Zhu19991999, vol.121, no.4
Thermomechanical durability analysis of flip chip solder interconnects: part 2--with underfillK. Darbha; J. H. Okura; S. Shetty; A. Dasgupta; T. Reinikainen; J. Zhu; J. F. J. M. Caers19991999, vol.121, no.4
Thermomechanical durability analysis of flip chip solder interconnects: part 1--without underfillK. Darbha; J. H. Okura; A. Dasgupta19991999, vol.121, no.4
Thermoelastic modeling of a PWB with simulated circuit traces subjected to infrared reflow soldering with experimental validationY. Polsky; I. C. Ume19991999, vol.121, no.4
Thermal management in direct chip attach assembliesD. F. Baldwin; J. T. Beerensson19991999, vol.121, no.4
Surface graft copolymerization enhanced lamination of poly(tetrafluoroethylene) film to copper and epoxy-based print circuit board (PCB)J. Zhang; C. Q. Cui; T. B. Lim; E. T. Kang19991999, vol.121, no.4
Modeling of the mechanical behavior of materials in "high-tech" systems: attributes and reviewE. Suhir19991999, vol.121, no.4
Investigation of a new lead free solder alloy using thin strip specimensW. Ren; Z. Qian; M. Lu; S. Liu; D. Shangguan19991999, vol.121, no.4
Flow-field prediction in submerged and confined jet impingement using the Reynolds stress modelG. K. Morris; S. V. Garimella; J. A. Fitzgerald19991999, vol.121, no.4
Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array packagesJ. Lau; T. Chen; S. -W. R. Lee19991999, vol.121, no.4
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