期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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1999, vol.121, no.1 1999, vol.121, no.2 1999, vol.121, no.3 1999, vol.121, no.4

题名作者出版年年卷期
An investigation of PWB layout by genetic algorithms to maximize fatigue lifeA. J. Scholand; R. E. Fulton; B. Bras19991999, vol.121, no.1
Characterizing the failure envelope of a conductive adhesiveD. Olliff; J. Qu; M. Gaynes; R. Kodnani; A. Zubelewicz19991999, vol.121, no.1
Forced convection heat transfer augmentation in a channel with a localized heat source using fibrous materialsD. Angirasa; G. P. Peterson19991999, vol.121, no.1
Modeling natural convection from horizontal isothermal annular heat sinksC. -S. Wang; M. M. Yovanovich; J. R. Culham19991999, vol.121, no.1
Nonlinear dynamic analysis of surface mount interconnects: part I--gheoryC. Basaran; R. Chandaroy19991999, vol.121, no.1
Nonlinear dynamic analysis of surface mount interconnects: part II--applicationsC. Basaran; R. Chandaroy19991999, vol.121, no.1
OMPAC package C5 reliability parametric studyB. Nagaraj19991999, vol.121, no.1
Overheating and frequent thermal cycling of outdoor electronic cabinets in cold climatesE. B. Zimmerman; H. Hegab; G. T. Colwell19991999, vol.121, no.1
Thermoelastic properties of plain weave composites for multilayer circuit board applicationsN. R. Sottos; J. M. Ockers; M. Swindeman19991999, vol.121, no.1



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