期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

1999, vol.121, no.1 1999, vol.121, no.2 1999, vol.121, no.3 1999, vol.121, no.4

题名作者出版年年卷期
An investigation of PWB layout by genetic algorithms to maximize fatigue lifeA. J. Scholand; R. E. Fulton; B. Bras19991999, vol.121, no.1
Characterizing the failure envelope of a conductive adhesiveD. Olliff; J. Qu; M. Gaynes; R. Kodnani; A. Zubelewicz19991999, vol.121, no.1
Forced convection heat transfer augmentation in a channel with a localized heat source using fibrous materialsD. Angirasa; G. P. Peterson19991999, vol.121, no.1
Modeling natural convection from horizontal isothermal annular heat sinksC. -S. Wang; M. M. Yovanovich; J. R. Culham19991999, vol.121, no.1
Nonlinear dynamic analysis of surface mount interconnects: part I--gheoryC. Basaran; R. Chandaroy19991999, vol.121, no.1
Nonlinear dynamic analysis of surface mount interconnects: part II--applicationsC. Basaran; R. Chandaroy19991999, vol.121, no.1
OMPAC package C5 reliability parametric studyB. Nagaraj19991999, vol.121, no.1
Overheating and frequent thermal cycling of outdoor electronic cabinets in cold climatesE. B. Zimmerman; H. Hegab; G. T. Colwell19991999, vol.121, no.1
Thermoelastic properties of plain weave composites for multilayer circuit board applicationsN. R. Sottos; J. M. Ockers; M. Swindeman19991999, vol.121, no.1



制造业外文文献服务平台