期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

1999, vol.121, no.1 1999, vol.121, no.2 1999, vol.121, no.3 1999, vol.121, no.4

题名作者出版年年卷期
Analytical derivation of the self-alignment motion of flip chip soldered componentsN. van Veen19991999, vol.121, no.2
Damage mechanics of surface mount technology solder joints under concurrent thermal and dynamic loadingR. Chandaroy; C. Basaran19991999, vol.121, no.2
Deformation behavior of two lead-free solders: indalloy 227 and castin alloyR. S. Whitelaw; R. W. Neu; D. T. Scot19991999, vol.121, no.2
Effect of edge and internal point support of a printed circuit board under vibrationG. H. Lim; J. H. Ong; J. E. T. Penny19991999, vol.121, no.2
Failure analysis of liquid crystal displays due to indium tin oxide breakdownT. J. Dishoungh; M. Dube; M. Pecht; J. Wyler19991999, vol.121, no.2
Failure estimation of semiconductor chip during wire bonding processT. Ikeda; N. Miyazaki; K. Kudo; K. Arita; H. Yakiyama19991999, vol.121, no.2
Integrated thermal analysis of natural convection air cooled electronic enclosureL. Tang; Y. K. Joshi19991999, vol.121, no.2
Mechanical deformation in conductive adhesives as measured with electron-beam moireE. S. Drexler; J. R. Berger19991999, vol.121, no.2
Modeling the deformation behavior of a Sn-Pb solder alloy using the simplified viscoplasticity theory based on overstress (VBO)L. Maciucescu; T. -L. Sham; E. Krempl19991999, vol.121, no.2
Natural convection cooling of vertical rectangular channels in air considering radiation and wall conductionD. A. Hall; G. C. Vliet; T. L. Bergman19991999, vol.121, no.2
12



制造业外文文献服务平台