期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1999, vol.121, no.1 1999, vol.121, no.2 1999, vol.121, no.3 1999, vol.121, no.4

题名作者出版年年卷期
A damage coupling framework of unified viscoplasticity for the fatigue of solder alloysZ. Qian; W. Ren; S. Liu19991999, vol.121, no.3
A heat sink performance study considering material, geometry, nozzle placement, and Reynolds number with air impingementJ. G. Maveety; J. F. Hendricks19991999, vol.121, no.3
Analysis of solder paste release in fine pitch stencil printing processesG. Rodriguez; D. F. Baldwin19991999, vol.121, no.3
Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloyX. Q. Shi; W. Zhou; H. L. J. Pang; Z. P. Wang19991999, vol.121, no.3
Hygrothermal fracture analysis of plastic IC package in reflow soldering processKang Yong Lee; Taek Sung Lee19991999, vol.121, no.3
Interior stress for axisymmetric abrasive indentation in the free abrasive machining process: slicing silicon wafers with modern wiresawF. Yang; I. Kao19991999, vol.121, no.3
J-lead solder joint thermal fatigue life modelT. E. Wong; L. A. Kachatorian; H. M. Cohen19991999, vol.121, no.3
Minimization of heat sink mass using CFD and mathematical optimizationK. J. Craig; D. J. de Kock; P. Gauche19991999, vol.121, no.3
Numerical and experimental prediction of transitional characteristics of flow and heat transfer in an array of heated blocksY. Asako; Y. Yamaguchi; M. Faghri19991999, vol.121, no.3
Three-dimensional versus two-dimensional finite element modeling of flip-chip packagesQ. Yao; J. Qu19991999, vol.121, no.3
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