期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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1999, vol.121, no.1 1999, vol.121, no.2 1999, vol.121, no.3 1999, vol.121, no.4

题名作者出版年年卷期
A statistical mechanical model of electrical carbon fiber contactsJ. Xie; M. Pecht; A. Dasgupta; J. A. Swift; S. J. Wallace19991999, vol.121, no.4
Alternative curing methods for FCOB underfillM. M. Merton; C. P. Malhotra; N. Nikmanesh; R. L. Mahajan19991999, vol.121, no.4
An elastoplastic beam model for column-grid-array solder interconnectsJ. A. Swanson; S. M. Heinrich; P. S. Lee19991999, vol.121, no.4
Consideration of parameter scattering in thermo mechanical characterization of advanced packagesT. Winkler; A. Schubert; E. Kaulfersch; B. Michel19991999, vol.121, no.4
Determination of fracture toughness for metal/polymer interfacesV. Sundararaman; S. K. Sitaraman19991999, vol.121, no.4
Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array packagesJ. Lau; T. Chen; S. -W. R. Lee19991999, vol.121, no.4
Flow-field prediction in submerged and confined jet impingement using the Reynolds stress modelG. K. Morris; S. V. Garimella; J. A. Fitzgerald19991999, vol.121, no.4
Investigation of a new lead free solder alloy using thin strip specimensW. Ren; Z. Qian; M. Lu; S. Liu; D. Shangguan19991999, vol.121, no.4
Modeling of the mechanical behavior of materials in "high-tech" systems: attributes and reviewE. Suhir19991999, vol.121, no.4
Surface graft copolymerization enhanced lamination of poly(tetrafluoroethylene) film to copper and epoxy-based print circuit board (PCB)J. Zhang; C. Q. Cui; T. B. Lim; E. T. Kang19991999, vol.121, no.4
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