期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2000, vol.12, no.1 2000, vol.12, no.2 2000, vol.12, no.3

题名作者出版年年卷期
The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMTQinong Zhu; Mei Sheng; Le Luo20002000, vol.12, no.3
Stencil design for mixed technology through-hole/SMT placement and reflowWilliam E. Coleman; Denis Jean; Julie R. Bradbury-Bennett20002000, vol.12, no.3
Rework of CSP: the effect on surface intermetallic growthT. A. Nguty; N. N. Ekere; J. D. Philpott; G. D. Jones20002000, vol.12, no.3
On the degradation of the solider joints of underfilled flip chip packages: a case studyZhang Qun; Xie Xiaoming; Chen Liu; Wang Guozhong; Cheng Zhaonian; Wolfgang Kempe20002000, vol.12, no.3
Development and validation of lead-free wave soldering processAtso Forsten; Hector Steen; Ian Wilding; Jurgen Friedrich20002000, vol.12, no.3
A study of solder paste printing requirement for CSP technologyJeff Kennedy20002000, vol.12, no.3
Wettability test method for surface mount technology assessmentC. C. Tu; M. E. Natishan20002000, vol.12, no.2
Viscoplastic anand model for solder alloys and its applicationZ. N. Cheng; G. Z. Wang; L. Chen; J. Wilde; K. Becker20002000, vol.12, no.2
The impact of underfill properties on the thermomechanical reliability of FCOB assemblyJicun Lu; Jianhua Wu; Yih Pin Liew; Thiam Beng Lim; Xiangfu Zong20002000, vol.12, no.2
The impact of process parameters on gold elimination from soldered connector assembliesP. T. Vianco; A. C. Kilgo20002000, vol.12, no.2
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