期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2000, vol.12, no.1 2000, vol.12, no.2 2000, vol.12, no.3

题名作者出版年年卷期
3D Si-on-Si stack packagingH. Kanbach; J. Wilde; F. Kriebel; E. Meusel20002000, vol.12, no.1
A novel high performance die attachX. M. Xie; T. B. Wang; J. Z. Shi; R. Q. Ye; F. Stubhan; J. Freytag20002000, vol.12, no.1
An alternative approach for the analysis of intermetallic compounds in SMT solder jointsI. K. Hui; H. W. Law20002000, vol.12, no.1
Investigation of a solder bumping technique for flip-chip interconnectionDavid A. Hutt; Daniel G. Rhodes; Paul P. Conway; Samjid H. Mannan; David C. Whalley; Andrew S. Holmes20002000, vol.12, no.1
Lead-free solders in Japan (a personal impression)W. J. Plumbridge20002000, vol.12, no.1
Reliability of unencapsulated SMD plastic film capacitorsAnne Seppala; Kimmo Saarinen; Eero Ristolainen20002000, vol.12, no.1



制造业外文文献服务平台