期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2000, vol.12, no.1 2000, vol.12, no.2 2000, vol.12, no.3

题名作者出版年年卷期
A study of solder paste printing requirement for CSP technologyJeff Kennedy20002000, vol.12, no.3
Development and validation of lead-free wave soldering processAtso Forsten; Hector Steen; Ian Wilding; Jurgen Friedrich20002000, vol.12, no.3
On the degradation of the solider joints of underfilled flip chip packages: a case studyZhang Qun; Xie Xiaoming; Chen Liu; Wang Guozhong; Cheng Zhaonian; Wolfgang Kempe20002000, vol.12, no.3
Rework of CSP: the effect on surface intermetallic growthT. A. Nguty; N. N. Ekere; J. D. Philpott; G. D. Jones20002000, vol.12, no.3
Stencil design for mixed technology through-hole/SMT placement and reflowWilliam E. Coleman; Denis Jean; Julie R. Bradbury-Bennett20002000, vol.12, no.3
The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMTQinong Zhu; Mei Sheng; Le Luo20002000, vol.12, no.3



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