期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2000, vol.122, no.1 2000, vol.122, no.2 2000, vol.122, no.3 2000, vol.122, no.4

题名作者出版年年卷期
Software "Reliability"?Robert S. Hanmer20002000, vol.122, no.4
Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat SinksW. W. Thrasher; T. S. Fisher; K. E. Torrance20002000, vol.122, no.4
A Simple Technique for Maximizing the Fundamental Frequency of Vibrating StructuresJ. H. Ong; G. H. Lim20002000, vol.122, no.4
Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP AssembliesReza Ghaffarian20002000, vol.122, no.4
An Analytical Model for Time-Dependent Shearing Deformation in Area-Array InterconnectsS. M. Heinrich; S. Shakya; J. Liang; P. S. Lee20002000, vol.122, no.4
Thermal Management of Surface Mount Power Magnetic ComponentsG. Refai-Ahmed; M. M. Yovanovich20002000, vol.122, no.4
Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into ChipsT. Elperin; A. Kornilov; G. Rudin20002000, vol.122, no.4
Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep AnalysisJohn H. Lau; S.-W. Ricky Lee; Chris Chang20002000, vol.122, no.4
Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect UnderfillsJohn H. Lau; S.-W. Ricky Lee20002000, vol.122, no.4
Finite Element Analysis of Stress Singularities in Attached Flip Chip PackagesA. Q. Xu; H. F. Nied20002000, vol.122, no.4
123456



制造业外文文献服务平台