期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
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2000, vol.122, no.1 2000, vol.122, no.2 2000, vol.122, no.3 2000, vol.122, no.4

题名作者出版年年卷期
Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit BoardEphraim Suhir20002000, vol.122, no.1
A System for First Order Reliability Estimation of Solder Joints in Area Array PackagesAnand M. Deshpande; Ganesh Subbarayan; Dan Rose20002000, vol.122, no.1
Decomposition Techniques for the Efficient Analysis of Area-Array PackagesAnand M. Deshpande; Ganesh Subbarayan20002000, vol.122, no.1
Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor EncapsulationSejin Han; K. K. Wang20002000, vol.122, no.1
On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging ApplicationsJang-hi Im; Edward O. Shaffer II; Theodore Stokich, Jr.; Andrew Strandjord; Jack Hetzner; James Curphy; Cheryl Karas; Greg Meyers; David Hawn; Ashok Chakrabarti; Steve Froelicher20002000, vol.122, no.1
Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics MethodJohn H. Lau; S. W. Ricky Lee20002000, vol.122, no.1
Over-Temperature Forecasts on Electronic Packages Through a Transient R-C ModelBen-Je Lwo; Kun-Fu Tseng; Ching-Hsing Kao; Luke Su Lu20002000, vol.122, no.1
Thermomechanical Fatigue Testing and Analysis of Solder AlloysM. A. Palmer; P. E. Redmond; R. W. Messler, Jr.20002000, vol.122, no.1
New Reworkable High Temperature Low Modulus (in Excess of 400-500℃) Adhesives for MCM-D AssemblyJiali Wu; Randy T. Pike; S. K. Sitaraman; C. P. Wong20002000, vol.122, no.1
Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging StructuresWeidong Xie; Suresh K. Sitaraman20002000, vol.122, no.1
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