期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2001, vol.13, no.1 2001, vol.13, no.2 2001, vol.13, no.3

题名作者出版年年卷期
ACA bonding technology of low cost electronics packaging applications - current status and remaining challengesJohan Liu20012001, vol.13, no.3
Lead-free reflow soldering for electronic assemblyM. R. Harrison; J. H. Vincent; H. A. H. Steen20012001, vol.13, no.3
Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free soldersL. Ye; Z. H. Lai; J. Liu; A. Tholen20012001, vol.13, no.3
The effect of PECVD SiN{sub}x moisture barrier layers on the degradation of a flip chi underfill materialG. Kaltenpoth; W. Siebert; X. -M. Xie; F. Stubhan20012001, vol.13, no.3
Ceramic chip scale package solder joint reliabilityJ. Seyyedi; J. Padgett20012001, vol.13, no.3
Stud bump bond packaging with reduced process stepsZhaowei Zhong20012001, vol.13, no.2
Critical factors affecting paste flow during the stencil printing of solder pasteR. Durairaj; T. A. Nguty; N. N. Ekere20012001, vol.13, no.2
Effects of Pb contamination on the eutectic Sn-Ag solder jointS. Choi; T. R. Bieler; K. N. Subramanian; J. P. Lucas20012001, vol.13, no.2
Reliability of FCOB with and without encapsulationZhaowei Zhong20012001, vol.13, no.2
Bending and twisting of cylindrical solder interconnections with creepJohn H. Lau20012001, vol.13, no.2
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