期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2001, vol.13, no.1 2001, vol.13, no.2 2001, vol.13, no.3

题名作者出版年年卷期
A high-performance lead-free solder - the effects of in on 99.3Sn/0.7CuJennie S. Hwang; Zhenfeng Guo; Holger Koenigsmann20012001, vol.13, no.2
Bending and twisting of cylindrical solder interconnections with creepJohn H. Lau20012001, vol.13, no.2
Reliability of FCOB with and without encapsulationZhaowei Zhong20012001, vol.13, no.2
Effects of Pb contamination on the eutectic Sn-Ag solder jointS. Choi; T. R. Bieler; K. N. Subramanian; J. P. Lucas20012001, vol.13, no.2
Critical factors affecting paste flow during the stencil printing of solder pasteR. Durairaj; T. A. Nguty; N. N. Ekere20012001, vol.13, no.2
Stud bump bond packaging with reduced process stepsZhaowei Zhong20012001, vol.13, no.2



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