期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2001, vol.123, no.1 2001, vol.123, no.2 2001, vol.123, no.3 2001, vol.123, no.4

题名作者出版年年卷期
A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip ChipsBoris Mirman; Emanuel Bobrov20012001, vol.123, no.4
Adhesion and Reliability of Epoxy/Glass InterfacesJohn E. Ritter; Armin Huseinovic20012001, vol.123, no.4
A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration LoadRon S. Li20012001, vol.123, no.4
Displacement Theory for Fixturing Design of Thin Flexible Circuit Board AssemblyRuijun Chen; Daniel F. Baldwin20012001, vol.123, no.4
Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys-Experiments and Constitutive ModelingKatsuhiko Sasaki; Ken-ichi Ohguchi; Hiromasa Ishikawa20012001, vol.123, no.4
Thermal Math Modeling and Analysis of an Electronic AssemblyK. N. Shukla20012001, vol.123, no.4
Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging ConceptDagmar Beyerlein; Lee E. Hornberger20012001, vol.123, no.4
Experimental Evaluation of Air-Cooling Electronics at High AltitudesHenry Wong; Robert E. Peck20012001, vol.123, no.4
Constitutive and Cyclic Damage Model of 63Sn-37Pb SolderV. Stolkarts; L. M. Keer; M. E. Fine20012001, vol.123, no.4
Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel DesignMohamed-Nabil Sabry20012001, vol.123, no.4
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