期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2001, vol.123, no.1 2001, vol.123, no.2 2001, vol.123, no.3 2001, vol.123, no.4

题名作者出版年年卷期
Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring BoardsYarom Polsky; I. Charles Ume20012001, vol.123, no.1
Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring BoardsR. Venkatraman; K. Ramakrishna; K. Knadle; W. T. Chen; G. C. Haddon20012001, vol.123, no.1
Evaluation of the Moisture Sensitivity of Molding Compounds of IC's PackagesH. Fremont; J. Y. Deletage; A. Pintus; Y. Danto20012001, vol.123, no.1
Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic PackagingChandra S. Desai; Russell Whitenack20012001, vol.123, no.1
Effect of Tool Wear on Force and Quality in Dam-Bar Cutting of Integrated Circuit PackagesC. F. Cheung; W. B. Lee; W. M. Chiu20012001, vol.123, no.1
Microwave Imaging for the Integrity Assessment of IC PackagesY. Ju; M. Saka; H. Abe20012001, vol.123, no.1
Moisture Diffusion in Epoxy Molding Compounds Filled With ParticlesM. Uschitsky; E. Suhir20012001, vol.123, no.1
A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder JointsJ. K. Chen; J. E. Beraun; D. Y. Tzou20012001, vol.123, no.1
Flip-Chip BGA Design to Avert Die CrackingJ.-B. Han20012001, vol.123, no.1
Development of Glass-Free Metal Electrically Conductive Thick FilmsZongrong Liu; D. D. L. Chung20012001, vol.123, no.1
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