期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2001, vol.123, no.1 2001, vol.123, no.2 2001, vol.123, no.3 2001, vol.123, no.4

题名作者出版年年卷期
Local Heat Transfer Distributions in Confined Multiple Air Jet ImpingementSuresh V. Garimella; Vincent P. Schroeder20012001, vol.123, no.3
Sizing of Heat Spreaders Above Dielectric LayersCalvin Chen; Marc Hodes; Lou Manzione20012001, vol.123, no.3
Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary ShapeJ. R. Culham; M. M. Yovanovich; P. Teertstra; C.-S. Wang; G. Refai-Ahmed; Ra-Min Tain20012001, vol.123, no.3
Thermal Performance of Integrated Plate Heat Pipe With a Heat SpreaderKoichiro Take; Ralph L. Webb20012001, vol.123, no.3
An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal CyclingYong Du; Jie-Hua Zhao; Paul Ho20012001, vol.123, no.3
A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic PackagesJ. V. C. Vargas; G. Stanescu; R. Florea; M. C. Campos20012001, vol.123, no.3
Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power PulsesA. G. Evans; M. Y. He; J. W. Hutchinson; M. Shaw20012001, vol.123, no.3
Mesh Sensitivity and FEA for Multi-Layered Electronic PackagingCemal Basaran; Ying Zhao20012001, vol.123, no.3
Identification of Minimum Air Flow Design for a Desktop Computer Using CFD ModelingJ. Y. Chang; C. W. Yu; R. L. Webb20012001, vol.123, no.3
A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array PackageSarang Shidore; Tien Yu Tom Lee20012001, vol.123, no.3
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