期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2001, vol.123, no.1 2001, vol.123, no.2 2001, vol.123, no.3 2001, vol.123, no.4

题名作者出版年年卷期
A Scalable Multi-Functional Thermal Test Chip Family: Design and EvaluationZs. Benedek; B. Courtois; G. Farkas; E. Kollar; S. Mir; A. Poppe; M. Rencz; V. Szekely; K. Torki20012001, vol.123, no.4
Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip PackagesK. N. Chiang; C. W. Chang; C. T. Lin20012001, vol.123, no.4
IGBT Package Design for High Power Aircraft Electronic SystemsFarhad Sarvar; David C. Whalley; Ming K. Low20012001, vol.123, no.4
Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel DesignMohamed-Nabil Sabry20012001, vol.123, no.4
Constitutive and Cyclic Damage Model of 63Sn-37Pb SolderV. Stolkarts; L. M. Keer; M. E. Fine20012001, vol.123, no.4
Experimental Evaluation of Air-Cooling Electronics at High AltitudesHenry Wong; Robert E. Peck20012001, vol.123, no.4
Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging ConceptDagmar Beyerlein; Lee E. Hornberger20012001, vol.123, no.4
Thermal Math Modeling and Analysis of an Electronic AssemblyK. N. Shukla20012001, vol.123, no.4
Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys-Experiments and Constitutive ModelingKatsuhiko Sasaki; Ken-ichi Ohguchi; Hiromasa Ishikawa20012001, vol.123, no.4
Displacement Theory for Fixturing Design of Thin Flexible Circuit Board AssemblyRuijun Chen; Daniel F. Baldwin20012001, vol.123, no.4
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