期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2002, vol.14, no.1 2002, vol.14, no.2 2002, vol.14, no.3

题名作者出版年年卷期
Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life testsP. Towashiraporn; G. Subbarayan; B. McLlvanie; B. C. Hunter; D. Love; B. Sullivan20022002, vol.14, no.3
Assessment of board level solder joint reliability for PBGA assemblies with lead-free soldersShi-Wei Ricky Lee; Ben Hoi Wai Lui; Y. H. Kong; Bernard Baylon; Timothy Leung; Pompeo Umali; Hector Agtarap20022002, vol.14, no.3
Fatigue crack growth behavior of lead-containing and lead-free soldersY. Mutoh; J. Zhao; Y. Miyashita; C. Kanchanomai20022002, vol.14, no.3
Low cycle fatigue and fatigue crack growth behavior of Sn-Ag eutectic solderC. Kanchanomai; Y. Miyashita; Y. Mutoh; S. L. Mannan20022002, vol.14, no.3
Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packagesL. C. Shiau; C. E. Ho; C. R. Kao20022002, vol.14, no.3
Evaluation of two novel lead-free surface finishesRichard Ludwig; Ning-Cheng Lee; Chonglun Fan; Yun Zhang20022002, vol.14, no.3
Lead-free solder process implementation for PCB assemblyPeter Collier; Vasudivan Sunappan; Arulvanan Periannan20022002, vol.14, no.3
Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal agingC. M. Lawrence Wu; M. L. Chau20022002, vol.14, no.2
Solder ball failure mechanisms in plastic ball grid array packagesC. H. Zhong; S. Yi; D. C. Whalley20022002, vol.14, no.2
Reliability of tin-lead balled BGAs soldered with lead-free solder pasteSami Tapani Nurmi; Eero Olavi Ristolainen20022002, vol.14, no.2
12



制造业外文文献服务平台