期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2002, vol.124, no.1 2002, vol.124, no.2 2002, vol.124, no.3 2002, vol.124, no.4

题名作者出版年年卷期
Transient Thermal Management of a Handset Using Phase Change Material (PCM)Marc Hodes; Randy D. Weinstein; Stephen J. Pence; Jason M. Piccini; Lou Manzione; Calvin Chen20022002, vol.124, no.4
Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing ApplicationsMudasir Ahmad; Suresh K. Sitaraman20022002, vol.124, no.4
Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic SwitchJ. Lau; Z. Mei; S. Pang; C. Amsden; J. Rayner; S. Pan20022002, vol.124, no.4
Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip AssembliesC. W. Tang; Y. C. Chan; K. C. Hung; P. L. Tu20022002, vol.124, no.4
An Analytical Cure Model for Underfill EpoxiesR. L. Mahajan; C. P. Malhotra; R. K. Sharma20022002, vol.124, no.4
Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder JointsKi-Ju Kang; Seon-Ho Choi; Tae-Sung Bae20022002, vol.124, no.4
Corrosion Analysis of a Fiber-Optic Transceiver HousingJ. H. Lau; C. L. Jiaa; S. J. Erasmus20022002, vol.124, no.4
Impact Resistance of SM Joints Formed With ICAC. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung20022002, vol.124, no.4
Study of P-V-T-C Relation of EMCYi-San Chang; Sheng-Jye Hwang; Huei-Huang Lee; Durn-Yuan Huang20022002, vol.124, no.4
Electrically Conductive Adhesive Formulations for SMT ApplicationsRyszard Kisiel20022002, vol.124, no.4
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