期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2002, vol.124, no.1 2002, vol.124, no.2 2002, vol.124, no.3 2002, vol.124, no.4

题名作者出版年年卷期
Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics ApproachesJ. Auersperg; E. Kieselstein; A. Schubert; B. Michel20022002, vol.124, no.4
Strength Evaluation of Notch Structure for Semiconductor Encapsulant ResinNoriyasu Kawamura; Takashi Kawakami; Kikuo Kishimoto; Masaki Omiya; Toshikazu Shibuya20022002, vol.124, no.4
Controlling Subcritical Crack Growth at Epoxy/Glass InterfacesJohn E. Ritter; G. S. Jacome; J. R. Pelch; T. P. Russell; T. J. Lardner20022002, vol.124, no.4
Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)C. L. Chung; James Fan; M. L. Huang; F. J. Tsai20022002, vol.124, no.4
Experimental Investigation of Residual Stresses in Layered Materials Using Moiré InterferometryKeith B. Bowman; David H. Mollenhauer20022002, vol.124, no.4
Determination of Packaging Material Properties Utilizing Image Correlation TechniquesD. Vogel; R. Kuhnert; M. Dost; B. Michel20022002, vol.124, no.4
Optical Measurements of Shrinkage in UV-Cured AdhesivesA. J. Hudson; S. C. Martin; M. Hubert; J. K. Spelt20022002, vol.124, no.4
Application of Ice Particles for Precision Cleaning of Sensitive SurfacesD. V. Shishkin; E. S. Geskin; B. Goldenberg20022002, vol.124, no.4
Chemical-Mechanical Planarization of Low-k Polymers for Advanced IC StructuresChristopher L. Borst; Dipto G. Thakurta; William N. Gill; Ronald J. Gutmann20022002, vol.124, no.4
Electrically Conductive Adhesive Formulations for SMT ApplicationsRyszard Kisiel20022002, vol.124, no.4
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