期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2003, vol.15, no.1 2003, vol.15, no.2 2003, vol.15, no.3

题名作者出版年年卷期
Thermal strain analysis of an electronics package using the SEM Moire techniqueZ. W. Zhong; S. K. Nah20032003, vol.15, no.3
Failures of flip chip assemblies under thermal shockCheng Bo; Wang Li; Zhang Qun; Gao Xia; Xie Xiaoming; Wolfgang Kempe20032003, vol.15, no.3
Mechanical characterization of Sn-3.5Ag solder joints at various temperaturesH. Rhee; K. N. Subramanian; A. Lee; J. G. Lee20032003, vol.15, no.3
Flip chip solder joint reliability under harsh environmentCheng Bo; Wang Li; Zhang Qun; Gao Xia; Xie Xiaoming; Wolfgang Kempe20032003, vol.15, no.3
Improving the fatigue life of a bare die flip chip by thinningT. Alander; I. Suominen; P. Heino; E. Ristolainen20032003, vol.15, no.3
Study of under bump metallisation barrier layer for lead-free solderK. C. Chan; Z. W. Zhong; K. W. Ong20032003, vol.15, no.2
A novel measurement technique for stencil printed solder pasteMilos Dusek; Christopher Hunt20032003, vol.15, no.2
The effect of the hot air levelling process on skip solder defects in the wave soldering processTeo Kiat Choon20032003, vol.15, no.2
Process characterization of PCB assembly using 0201 packages with lead-free solderDavid Geiger; Fredrik Mattsson; Dongkai Shangguan; M. T. Ong; Patrick Wong; Mei Wang; Todd Castello; Sammy Yi20032003, vol.15, no.2
Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumpingYanhong Tian; Chunqing Wang; Xiaodong Zhang; Deming Liu20032003, vol.15, no.2
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