期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2003, vol.125, no.1 2003, vol.125, no.2 2003, vol.125, no.3 2003, vol.125, no.4

题名作者出版年年卷期
Effect of Bonding Force on the Conducting Particle With Different SizesN. H. Yeung; Y. C. Chan; C. W. Tan20032003, vol.125, no.4
3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free ComponentsJohn H. Lau; Stephen H. Pan20032003, vol.125, no.4
Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding InterfaceTan Chee Wei; Abdul Razak Daud20032003, vol.125, no.4
Electrical Conductive Characteristics of Anisotropic Conductive Adhesive ParticlesG. B. Dou; Y. C. Chan; Johan Liu20032003, vol.125, no.4
Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic DeviceJohn H. Lau; Steve Erasmus; Yida Zou20032003, vol.125, no.4
Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip InterconnectsR. T. P. Lee; A. S. Zuruzi; S. K. Lahiri20032003, vol.125, no.4
Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal PerformanceVictor Adrian Chiriac; Tien-Yu Tom Lee20032003, vol.125, no.4
Solders Fatigue Prediction Using Interfacial Boundary Volume CriterionX. J. Zhao; G. Q. Zhang; J. F. J. M. Caers; L. J. Ernst20032003, vol.125, no.4
Micro to Macro Thermo-Mechanical Simulation of Wafer Level PackagingChang-An Yuan; Kou-Ning Chiang20032003, vol.125, no.4
Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary ElementA. A. O. Tay; K. H. Lee; K. M. Lim20032003, vol.125, no.4
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