期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2004, vol.126, no.1 2004, vol.126, no.2 2004, vol.126, no.3 2004, vol.126, no.4

题名作者出版年年卷期
Highlights from the European Thermal Project PROFITClemens J. M. Lasance20042004, vol.126, no.4
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid ArrayTong Hong Wang; Yi-Shao Lai; Jenq-Dah Wu20042004, vol.126, no.4
Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration SystemYasin Makwana; Dereje Agonafer; Dan Manole20042004, vol.126, no.4
Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping PowerC. P. Tso; K. W. Tou; H. Bhowmik20042004, vol.126, no.4
Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder JointY. C. Chan; M. O. Alam; K. C. Hung; H. Lu; C. Bailey20042004, vol.126, no.4
Thermal Performance of Next Generation of Modulated Pump Lasers in Telco EquipmentGamal Refai-Ahmed; Stephanie Trottier20042004, vol.126, no.4
An Analytical Study of the Optimized Performance of an Impingement Heat SinkS. B. Sathe; B. G. Sammakia20042004, vol.126, no.4
Methodology for an Integrated (Electrical/Mechanical) Design of PWBAWonkee Ahn; Dereje Agonafer; Shlomo Novotny20042004, vol.126, no.4
Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System ApplicationSiddharth Bhopte; Musa S. Alshuqairi; Dereje Agonafer; Gamal Refai-Ahmed20042004, vol.126, no.4
Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air TemperaturesRoger Schmidt; Ethan Cruz20042004, vol.126, no.4
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