期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2004, vol.126, no.1 2004, vol.126, no.2 2004, vol.126, no.3 2004, vol.126, no.4

题名作者出版年年卷期
Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon WafersX. J. Xin; Z. J. Pei; Wenjie Liu20042004, vol.126, no.2
A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder BumpsChyi-Lang Lai; Wen-Bin Young20042004, vol.126, no.2
Characterization of Substrate Materials for System-in-a-Package ApplicationsLiu Chen; Anders S. G. Andrae; Gang Zou; Johan Liu20042004, vol.126, no.2
Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene) Bumping Dielectrics Under Temperature CyclingWoon-Seong Kwon; Hyoung-Joon Kim; Kyung-Wook Paik; Se-Young Jang; Soon-Min Hong20042004, vol.126, no.2
Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder AlloyQiang Xiao; Harold J. Bailey; William D. Armstrong20042004, vol.126, no.2
Transport Phenomena in Two-Phase Micro-Channel Heat SinksWeilin Qu; Issam Mudawar20042004, vol.126, no.2
Testing and Modeling of Solders Using New Test Device, Part 1: Models and TestingChandrakant S. Desai; Zhichao Wang; Russell Whitenack; Tribikram Kundu20042004, vol.126, no.2
Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and ValidationChandrakant S. Desai; Zhichao Wang; Russell Whitenack; Tribikram Kundu20042004, vol.126, no.2
Development of G-Helix Structure as Off-Chip InterconnectQi Zhu; Lunyu Ma; Suresh K. Sitaraman20042004, vol.126, no.2
Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat SinksDuckjong Kim; Sung Jin Kim20042004, vol.126, no.2
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