期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2005, vol.17, no.1 2005, vol.17, no.2 2005, vol.17, no.3 2005, vol.17, no.4

题名作者出版年年卷期
Low cycle fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb solder jointsPeng Sun; Cristina Andersson; Xicheng Wei; Liqiang Cao; Zhaonian Cheng; Johan Liu20052005, vol.17, no.4
Lead-free PCB assembly and effects of process conditions on the profile and reliability of solder jointsP. Arulvanan; X. Q. Shi20052005, vol.17, no.4
Investigation of the effect of solder flux residues on RF signal integrity using real circuitsDavid Geiger; Dongkai Shangguan20052005, vol.17, no.4
Correlation between jamming and skipping during solder paste printingS. R. Hillman; S. H. Mannan; R. Durairaj; A. Seman; N. N. Ekere; M. Dusek; C. Hunt20052005, vol.17, no.4
Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cyclingJunling Chang; Dirk Janz; W. Kempe; Xiaoming Xie20052005, vol.17, no.4
Effect of PCB surface finish on creep properties of lead-free solder jointsJanne J. Sundelin; Sami T. Nurmi; Toivo K. Lepisto; Eero O. Ristolainen20052005, vol.17, no.4
Application of a design of experiments approach to the reliability of a PBGA packageFi Hyuck Yang; Kang Yong Lee20052005, vol.17, no.3
Solder joint reliability in AgPt-metallized LTCC modulesOlli Nousiaianen; Risto Rautioaho; Kan Kautio; Fussi Faaskeldinen; Seppo Leppdvuori20052005, vol.17, no.3
The effect of thermal cycling on the contact resistance of anisotropic conductive jointsL. Ali; Y. C. Chan; M. O. Alam20052005, vol.17, no.3
Effect of SnAgCu composition on soldering performanceBenlih Huang; Arnab Dasgupta; Ning-Cheng Lee20052005, vol.17, no.3
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