期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2005, vol.17, no.1 2005, vol.17, no.2 2005, vol.17, no.3 2005, vol.17, no.4

题名作者出版年年卷期
Fluxless plasma bumping of lead-free solders and the reliability effects of under bump metallization thicknessJoon Kwon Moon; Y. Zhou; Jae Pil Jung20052005, vol.17, no.2
Microstructural investigation of lead-free BGAs soldered with tin-lead solderGunter Grossmann; Joy Tharian; Pascal Fud; Urs Sennhauser20052005, vol.17, no.2
The impact of thermal cycling regime on the shear strength of lead-free solder jointsMilos Dusek; Martin Wickham; Christopher Hunt20052005, vol.17, no.2
A systematic procedure for the selection of a lead-free solder paste in an electronics manufacturing environmentGirish S. Wable; Quyen Chu; Purushothaman Damodaran; Krishnaswami Srihari20052005, vol.17, no.2
The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageingM. J. Rizvi; Y. C. Chan; C. Bailey; H. Lu; A. Sharif20052005, vol.17, no.2



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