期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package ManufacturingK.-F. Becker; T. Braun; A. Neumann; A. Ostmann; E. Coko; M. Koch; V. Bader; R. Aschenbrenner; H. Reichl20052005, vol.127, no.1
Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP ApplicationsA. Polyakov; M. Bartek; J. N. Burghartz20052005, vol.127, no.1
Adhesive Joining Process and Joint Property With Low Melting Point FillerKiyokazu Yasuda; Jong-Min Kim; Kozo Fujimoto20052005, vol.127, no.1
Resin Self-Alignment Processes for Self-Assembly SystemsJong-Min Kim; Kiyokazu Yasuda; Kozo Fujimoto20052005, vol.127, no.1
Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS PackagingZ. W. Zhong; S. C. Lim; A. Asundi20052005, vol.127, no.1
Various Adhesives for Flip ChipsZ. W. Zhong20052005, vol.127, no.1
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer FilmV. Gonda; J. den Toonder; J. Beijer; G. Q. Zhang; L. J. Ernst20052005, vol.127, no.1
PCR Microchip Array Based on Polymer Bonding TechniqueXiaomei Yu; Ting Li; Lin Hao; Dacheng Zhang20052005, vol.127, no.1
Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide SubstrateLiqiang Cao; Zonghe Lai; Johan Liu20052005, vol.127, no.1
Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package ApplicationsMan-Lung Sham; Jang-Kyo Kim20052005, vol.127, no.1
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