期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
Development of Novel Filler Technology for No-Flow and Wafer Level Underfill MaterialsSlawomir Rubinsztajn; Donald Buckley; John Campbell; David Esler; Eric Fiveland; Ananth Prabhakumar; Donna Sherman; Sandeep Tonapi20052005, vol.127, no.2
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal DeformationWoon-Seong Kwon; Myung-Jin Yim; Kyung-Wook Paik; Suk-Jin Ham; Soon-Bok Lee20052005, vol.127, no.2
Snap-Curing Electrically Conductive Formulation for Solder Replacement ApplicationsAndrzej Moscicki; Jan Felba; Tadeusz Sobierajski; Jozef Kudzia20052005, vol.127, no.2
Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)John Lau; Walter Dauksher20052005, vol.127, no.2
Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile FinsY. S. Chung; D. H. Lee; P. M. Ligrani20052005, vol.127, no.2
Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip-Influence of Reflow Soldering and Environmental TestingW. K. Chiang; Y. C. Chan20052005, vol.127, no.2
Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip AssembliesDaijiao Wang; Ronald L. Panton20052005, vol.127, no.2
Performance of Graphite Foam Evaporator for Use in Thermal ManagementJohnathan S. Coursey; Jungho Kim; Paul J. Boudreaux20052005, vol.127, no.2
Submodeling Analysis for Path-Dependent Thermomechanical ProblemsTong Hong Wang; Yi-Shao Lai20052005, vol.127, no.2
An Experimental and Numerical Study of a Liquid Mixing Device for MicrosystemsKazuyoshi Fushinobu; Masashi Nakata20052005, vol.127, no.2
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