期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular ChannelH. Bhowmik; K. W. Tou20052005, vol.127, no.3
Dynamics of Board-Level Drop ImpactE. H. Wong20052005, vol.127, no.3
A Damage-Mechanics-Based Constitutive Model for Solder JointsC. Basaran; Y. Zhao; H. Tang; J. Gomez20052005, vol.127, no.3
Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular ChannelH. Bhowmik; C. P. Tso; K. W. Tou20052005, vol.127, no.3
A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat SinksTzer-Ming Jeng; Li-Kang Liu; Ying-Huei Hung20052005, vol.127, no.3
Effect of Stress on the Dielectric Constant of AluminaSihai Wen; D. D. L. Chung20052005, vol.127, no.3
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading ConditionsTae-Sang Park; Soon-Bok Lee20052005, vol.127, no.3
Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free ConvectionValerie Eveloy; Peter Rodgers; M. S. J. Hashmi20052005, vol.127, no.3
Multiscale Mechanics in Microelectronics: A Paradigm in MiniaturizationM. G. D. Geers; V. Kouznetsova; W. A. M. Brekelmans20052005, vol.127, no.3
A Micromechanics-Based Vapor Pressure Model in Electronic PackagesX. J. Fan; J. Zhou; G. Q. Zhang; L. J. Ernst20052005, vol.127, no.3
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