期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
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2023 2024

2006, no.1sup 2006, vol.18, no.1 2006, vol.18, no.2 2006, vol.18, no.3 2006, vol.18, no.4

题名作者出版年年卷期
The effect of reflow profile on SnPb and SnAgCu solder joint shear strengthJianbiao Pan; Brian J. Toleno20062006, vol.18, no.4
Determining conformal coating protectionChristopher Hunt; Angela Mensah; Anthony Buxton; Richard Holman20062006, vol.18, no.4
The effects of chip and substrate thickness on the reliability of ACA bonded flip chip jointsLaura Frisk; Kati Kokko20062006, vol.18, no.4
Failure analysis techniques for lead-free solder jointsTodd Castello; Dan Rooney; Dongkai Shangguan20062006, vol.18, no.4
Reliability of ACA bonded flip chip joints on LCP and PI substratesLaura Frisk; Anne Cumini20062006, vol.18, no.4
Laser soldering control using optical imagingJames M. Gilbert; Zaif Dabestani20062006, vol.18, no.4
Characterization of tin oxidation products using sequential electrochemical reduction analysis (SERA)D. D. Hillman; L. S. Chumbley20062006, vol.18, no.3
Dissolution of stainless steels in molten lead-free soldersTadashi Takemoto; Masaharu Takemoto20062006, vol.18, no.3
Minimizing flux spatter during lead-free reflow assemblyDeepak Manjunath; Satyanarayan Iyer; Shawn Eckel; Purushothaman Damodaran; Krishnaswami Srihari20062006, vol.18, no.3
Learning from the migration to lead-free solderRichard Ciocci; Michael Pecht20062006, vol.18, no.3
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