期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2005 2006 2007 2008 2009 2010
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2023 2024

2006, no.1sup 2006, vol.18, no.1 2006, vol.18, no.2 2006, vol.18, no.3 2006, vol.18, no.4

题名作者出版年年卷期
Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder jointPeng Sun; Cristina Andersson; Xicheng Wei; Zhaonian Cheng; Dongkai Shangguan; Johan Liu20062006, vol.18, no.2
High strain rate testing of solder interconnectionsK. T. Tsai; F.-L. Liu; E. H. Wong; R. Rajoo20062006, vol.18, no.2
Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after agingLi-Yin Hsiao; Jenq-Gong Duh20062006, vol.18, no.2
Macro-micro modelling of moisture induced stresses in an ACF flip chip assemblyC. Y. Yin; H. Lu; C. Bailey; Y. C. Chan20062006, vol.18, no.2
High performance anisotropic conductive adhesives for lead-free interconnectsYi Li; C. P. Wong20062006, vol.18, no.2
Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binderMasahiro Inoue; Katsuaki Suganuma20062006, vol.18, no.2
Finite element analysis of fleXBGA reliabilityGang Chen; Xu Chen20062006, vol.18, no.2



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