期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

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2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
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2023 2024

2006, no.1sup 2006, vol.18, no.1 2006, vol.18, no.2 2006, vol.18, no.3 2006, vol.18, no.4

题名作者出版年年卷期
Laser soldering control using optical imagingJames M. Gilbert; Zaif Dabestani20062006, vol.18, no.4
Reliability of ACA bonded flip chip joints on LCP and PI substratesLaura Frisk; Anne Cumini20062006, vol.18, no.4
Failure analysis techniques for lead-free solder jointsTodd Castello; Dan Rooney; Dongkai Shangguan20062006, vol.18, no.4
The effects of chip and substrate thickness on the reliability of ACA bonded flip chip jointsLaura Frisk; Kati Kokko20062006, vol.18, no.4
Determining conformal coating protectionChristopher Hunt; Angela Mensah; Anthony Buxton; Richard Holman20062006, vol.18, no.4
The effect of reflow profile on SnPb and SnAgCu solder joint shear strengthJianbiao Pan; Brian J. Toleno20062006, vol.18, no.4



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