期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2006, vol.128, no.1 2006, vol.128, no.2 2006, vol.128, no.3 2006, vol.128, no.4

题名作者出版年年卷期
Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) StandardsJinny Rhee; Sergio I. Hernandez20062006, vol.128, no.4
Singulation of Electronic Packages With Abrasive WaterjetsMohamed Hashish20062006, vol.128, no.4
Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and ExperimentTunc Icoz; Nitin Verma; Yogesh Jaluria20062006, vol.128, no.4
Graphite Foam Thermal Management of a High Packing Density Array of Power AmplifiersZ. A. Williams; J. A. Roux20062006, vol.128, no.4
Optimal Support Locations for a Printed Circuit Board Loaded With Heavy ComponentsKun-Nan Chen20062006, vol.128, no.4
Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array AssembliesS. Chaparala; J. M. Pitarresi; S. Parupalli; S. Mandepudi; M. Meilunas20062006, vol.128, no.4
Constructal Peripheral Cooling of a Rectangular Heat-Generating AreaAlexandre K. da Silva; Louis Gosselin20062006, vol.128, no.4
A Graphite Foams Based Vapor Chamber for Chip Heat SpreadingMinhua Lu; Larry Mok; R. J. Bezama20062006, vol.128, no.4
Test Methods for Silicon Die StrengthM. Y. Tsai; C. H. Chen; C. S. Lin20062006, vol.128, no.4
Experimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat SinksZhipeng Duan; Y. S. Muzychka20062006, vol.128, no.4
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