期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2007, vol.19, no.1 2007, vol.19, no.2 2007, vol.19, no.3 2007, vol.19, no.4

题名作者出版年年卷期
Low cycle isothermal fatigue properties of lead-free soldersMilos Dusek; Christopher Hunt20072007, vol.19, no.4
Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrateZ. W. Zhong; P. Arulvanan; Hla Phone Maw; C. W. A. Lu20072007, vol.19, no.4
Hydrocarbon fluxes for ionic compound free solderingToshihiro Miyake; Masaru Ishida; Satoshi Inagaki20072007, vol.19, no.4
Assembly issues with Sn/Ag/Cu bumped flip chipsSunil Gopakumar; Peter Borgesen; K. Srihari20072007, vol.19, no.4
Multiphysics simulation of microwave curing in micro-electronics packaging applicationsT. Tilford; K. I. Sinclair; C. Bailey; M. P. Y. Desmulliez; G. Goussettis; A. K. Parrott; A. J. Sangster20072007, vol.19, no.3
Interfacial reactions between Sn-based solders and AgPt thick film metallizations on LTCCOlli Nousiainen; Tero Kangasvieri; Kari Ronka; Risto Rautioaho; Jouko Vahakangas20072007, vol.19, no.3
The evolution of paste pressure during stencil printingDavid J. Clements; Marc P. Y. Desmulliez; Eitan Abraham20072007, vol.19, no.3
Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%AgMi Jin Kim; Y. (Norman) Zhou; Jae Pil Jung20072007, vol.19, no.3
High-cycle fatigue testing of Pb-free solder jointsN. Barry; I. P. Jones; T. Hirst; I. M. Fox; J. Robins20072007, vol.19, no.2
Global environmental impact assessment of the Pb-free shiftAnders S. G. Andrae; Norihiro Itsubo; Atsushi Inaba20072007, vol.19, no.2
12



制造业外文文献服务平台